IC Development and Packaging

Pin 1 offers subcontract IC assembly and packaging services to the integrated circuits community, including but not limited to RFIC, MMIC, solar power, and opto-electronics.

From small lot quick-turns to continual or recurrent assembly requirements for your standard devices, Pin 1 can assemble your device and bill of materials dependably and accurately.

All process steps are performed in a Class 10000 clean room environment with ESD protection and static monitoring throughout.

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