Multi-Chip Modules

As IC chip geometries and package footprints continue to shrink, the density of chips placed into conventional packages is ever increasing. From the simplest two die configurations to complex twenty or thirty device densities, most assemblies can be accommodated on plastic, ceramic, metal or PCB substrates.

Hybrids and Power Devices

Another dimension to multi-chips is the addition of chip capacitors, resistors, rectifiers, etc.

Pin 1 can develop a customized process to accommodate for solder reflow, adhesive organic burn out, and high temperature cure requirements.

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