High speed singulation of wafers, ceramic substrate, plastic encapsulated devices. Using various dicing blade composite materials, complete separation and singulation of hard, brittle, metallic, polymer compositions is completed cleanly and quickly. The singulation process utilizes de-ionized H2O for ESD control.



  Copyright 2008 - 2016 by Pin 1 Technology | Privacy Policy | Login  
  Logo designed and created by Jeffery Smith: jasworks@mac.com  
  Website Solutions by E-Nor